Bonding chips and packages
This workshop is devoted to make the bonding between chip and package. It has all the required resources to face the challenges that deep-submicron technologies pose, allowing connections with pitch sizes down to 50 µm. This workshop features two semi-automatic ultrasound micro-soldering machines, with thread diameters of up to 17 µm, for ball-bonding and wedge-bonding. To verify the quality of connections, there is a micro-soldering test system for evaluating thread-resistance and solder ball shear. It also has two chip and wafer storage units for keeping ICs at optimal temperature and humidity conditions.
