The need for new tools and simulation methodologies to evaluate the impact of all reliability effects in ICs is a critical challenge for the electronic industry. Issues due to process-related variations (also known as spatial variability) are well-known and off-the-shelf simulation methods are available. On the other hand, models and simulation methods for the aging-related problems, which are becoming more important with each technology node, are far less mature, specially for analog ICs. In this sense, transistor wear-out phenomena such as Bias Temperature Instability (BTI) and Hot Carriers Injection (HCI) cause a time-dependent variability that occurs together with the spatial variability. A fundamental missing piece in the design flow is an efficient and accurate simulation methodology for IC reliability. To this goal, several challenges should be addressed properly: the essential nature of the stochastic behavior of aging (and thus resorting to stochastic models rather than deterministic ones), the correlation between spatial and aging-related variability, and relationship between biasing, stress and aging in analog ICs, among others. This paper discusses some of these challenges in detail.
Journal Paper -
Integration, the VLSI Journal, Article in Press, first online, 2016 ELSEVIER
DOI: 10.1016/j.vlsi.2016.05.002 ISSN: 0167-9260 » doi